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Expanding capabilities: On top of wafer probing &
processing, component & assembly, and packaging testing,
Inari is expanding to include integrated module assembly &
testing capabilities. For 2020 and beyond in advanced SiP,
the group is developing electromagnetic interference (EMI)
technology products which allow for enhanced heat
dissipation, an important feature for 5G smartphones. The
products can be used for RF but would be especially
important in power devices for heat diss
New confirmed project: As at December 2020, the group
signed a contract with Customer 1 which is based in China to
assemble optical modules. From March 2021 onwards, the
group will start qualification of its 1
st optical transceiver
modules production line and target mass production by May
2021. From June 2021 onwards, the group will start
transferring its 2
nd production line.
Potential projects in discussion: The group is also in the
midst of discussion with two US-based cus
Potential projects in discussion: The group is also in the
midst of discussion with two US-based customers, one for chip
and module assembly and another for power module
assembly. Both are in the “refer for quotation” (RFQ) stage,
pending review by both customers.
thanks for sharing near future prospect. With additional business coming in, hopefully the next 2 Qs will see another w consecutive records breaking in EPS
